| 摘要 |
The present invention provides a system for processing a semiconductor substrate using a laser beam, the system including: a storing unit storing a process control data set for a slot for loading the semiconductor substrate therein; a process controlling unit detecting identification information of the slot in which the semiconductor substrate is loaded, and reading the control data, which is set for the detected identification information, from the storing unit to control a process of the semiconductor substrate; and a substrate processing unit processing the semiconductor substrate on the basis of the read control data using the laser beam with a predetermined energy.
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