发明名称 |
Surface inspection apparatus and surface inspection method for strained silicon wafer |
摘要 |
An image pickup device disposed in a predetermined position relative to a surface of a strained silicon wafer photographs the surface of the strained silicon wafer in a plurality of rotation angle positions on photographing conditions under which bright lines appearing on the surface of the strained silicon wafer can be photographed, in an environment where a light source device illuminates the surface of the strained silicon wafer which is rotating. A composite image in a predetermined angle position is generated from surface images of the strained silicon wafer in a plurality of rotation angle positions obtained by the image pickup device.
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申请公布号 |
US7679730(B2) |
申请公布日期 |
2010.03.16 |
申请号 |
US20060908554 |
申请日期 |
2006.03.27 |
申请人 |
SHIBAURA MECHATRONICS CORPORATION;COVALENT MATERIALS CORPORATION |
发明人 |
TAKANO HIDEAKI;SHIMIZU MIYUKI;SENDA TAKESHI;IZUNOME KOJI;HAYASHI YOSHINORI;HAMATANI KAZUHIKO |
分类号 |
G01B11/16 |
主分类号 |
G01B11/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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