| 发明名称 |
Method and apparatus for an improved bellows shield in a plasma processing system |
| 摘要 |
The present invention presents an improved bellows shield for a plasma processing system, wherein the design and fabrication of the bellows shield coupled to a substrate holder electrode advantageously provides protection of a bellows with substantially minimal erosion of the bellows shield.
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| 申请公布号 |
US7678226(B2) |
申请公布日期 |
2010.03.16 |
| 申请号 |
US20070671282 |
申请日期 |
2007.02.05 |
| 申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
SAIGUSA HIDEHITO;TAKASE TAIRA;MITSUHASHI KOUJI;NAKAYAMA HIROYUKI |
| 分类号 |
H01L21/00;C23C16/00;H01J37/00;H01J37/02;H01J37/32;H01L21/306 |
主分类号 |
H01L21/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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