METHOD OF FORMING A LEADED MOLDED ARRAY PACKAGE

摘要

IN ONE EMBODIMENT, A METHOD FOR FORMING A LEADED MOLDED ARRAY PACKAGE INCLUDES PLACING A LEAD FRAME ASSEMBLY (10) INTO A MOLDING APPARATUS HAVING LEAD CAVITIES. THE METHOD FURTHER INCLUDES FORMING SEALS (81) BETWEEN CONDUCTIVE LEADS (17) WITHIN THE LEAD FRAME ASSEMBLY (10) AND THE LEAD CAVITIES, AND ENCAPSULATING THE LEAD FRAME ASSEMBLY (10) TO FORM A MOLDED ARRAY ASSEMBLY (28). THE MOLDED ARRAY ASSEMBLY (28) IS THEN SEPARATED INTO INDIVIDUAL LEADED MOLDED PACKAGES.