POLIERKISSEN ZUM CHEMISCH-MECHANISCHEN POLIEREN VON SUBSTRATEN IN GEGENWART VON SCHLEIFPARTIKELN ENTHALTENDE AUFSCHLÄMMUNG

摘要

A polishing pad (10) for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed. The polishing pad (10) includes a soluble component (14), preferably fibrous, within a polymer matrix component (16). The fibrous component (14) includes fibers soluble in the slurry sufficiently to provide a void structure in the polishing surface (20) of the pad (10). The void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface. Additives that further enhance polishing and/or assist in the removal of residues generated during polishing, such as surfactants and removers, are optionally incorporated in the fibrous substance or topographically coated on the fibrous substance.