| 摘要 |
PURPOSE: A printed circuit board for manufacturing a semiconductor package and a method for manufacturing the semiconductor package using the same are provided to prevent misalignment of a semiconductor chip by preventing the discoloration of a reference terminal of the printed circuit board through an oxide prevention layer. CONSTITUTION: An electrode terminal pattern(110) is formed on one side of a substrate body(106). A ball land pattern(112) is arranged on the other side facing one side of the substrate body. An oxide prevention layer(114) covers the electrode terminal pattern and the ball land pattern, and includes a condition reaction material removed from the electrode terminal pattern and the ball land pattern by a specific condition.
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