LIGHT-EMITTING DIODE PACKAGE

摘要

PURPOSE: A light-emitting diode package is provided to improve thermal characteristic by reducing the thermal resistance between a package and an LED chip. CONSTITUTION: A light emitting device package comprises a package body(10), a first lead frame(21), a second lead frame(22), an LED chip(30), and an adhesive sheet(40). The package body comprises a space part(12). The first lead frame comprises a lower end surface exposing for emitting heat. A part of the second lead frame is exposed to the bottom surface of the space part of the package body. The LED chip is electrically connected to the first lead frame and the second lead frame. The adhesive sheet places the LED chip through the die bonding. The adhesive sheet is comprised of an adhesive resin. The adhesive resin contains an inorganic powder.