EVAPORATION APPARATUS AND EVAPORATION METHOD THE SAME

摘要

PURPOSE: An evaporation apparatus and an evaporation method the same are provided to exactly control thickness of a deposition film by correcting thickness of deposition in real time. CONSTITUTION: A deposition apparatus comprises a processing chamber(100), a transfer chamber(110), a substrate mounting unit(300), a deposition source(400), and a thickness measurement unit(500). A processing chamber forms a reaction space. A transfer chamber is connected to the processing chamber. The substrate mounting unit is located within the processing chamber. The substrate is placed in the substrate mounting unit. The deposition source stores a raw material. The thickness measurement unit measures the thickness of the deposition film.