发明名称 LASER PROCESSING METHOD
摘要 <p>A LASER PROCESSING METHOD BY WHICH AN OBJECT TO BE PROCESSED (1) CAN BE CUT WITH A HIGH PRECISION IS PROVIDED. THE LASER PROCESSING METHOD OF THE PRESENT INVENTION IRRADIATES A PLANAR OBJECT TO BE PROCESSED (I) WITH LASER LIGHT (L) WHILE LOCATING A LIGHT-CONVERGING POINT (P) WITHIN THE OBJECT (1). INITIALLY, A FIRST MODIFIED REGION (71) TO BECOME A START POINT FOR CUTTING IS FORMED ALONG A FIRST LINE TO CUT (5A) IN THE OBJECT (I). SUBSEQUENTLY, ALONG A SECOND LINE TO CUT (5B) INTERSECTING THE LINE TO CUT (5A), A SECOND MODIFIED REGION (72) TO BECOME A START POINT FOR CUTTING IS FORMED SO AS TO INTERSECT AT LEAST A PART OF THE MODIFIED REGION (71). THEN, A FOURTH MODIFIED REGION (73) TO BECOME A START POINT FOR CUTTING IS FORMED ALONG THE LINE TO CUT (5B). THEREAFTER, BETWEEN THE MODIFIED REGION (71) AND AN ENTRANCE FACE (LA) OF THE OBJECT (I) WHERE THE LASER LIGHT (L) IS INCIDENT, A THIRD MODIFIED REGION (74) TO BECOME A START POINT FOR CUTTING IS FORMED ALONG THE LINE TO CUT (5A) SO AS TO INTERSECT AT LEAST A PART OF THE MODIFIED REGION (73).</p>
申请公布号 MY141090(A) 申请公布日期 2010.03.15
申请号 MY2005PI03468 申请日期 2005.07.28
申请人 HAMAMATSU PHOTONICS K.K. 发明人 TAKESHI SAKAMOTO
分类号 B23K26/40;B23K26/00 主分类号 B23K26/40
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