| 摘要 |
PURPOSE: A semiconductor package is provided to prevent the deterioration of reliability of the package by preventing misalignment of a bump and a substrate electrode terminal. CONSTITUTION: A semiconductor chip(204) includes a bonding pad(206) on the upper side and an incline surface connected to the upper side. A substrate(202) faces the upper side of the semiconductor chip and includes a bottom surface with an electrode terminal position on the corresponding part to the bonding pad and a sidewall facing the incline surface. A connection unit connects the electrode terminal to the bonding pad.
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