发明名称 Adhesive i.e. epoxy adhesive, pattern for bonding semiconductor chip on substrate, has three lines that succeed one another, where one of lines runs transverse to other two lines that run parallel to each other
摘要 #CMT# #/CMT# The pattern (6) has three lines (8-10) that succeed one another, where one of the lines (9) runs transverse to the other two lines that run parallel to each other. The two lines are provided at a distance from each other. The pattern has a Z-shaped contour that is defined on a substrate (1) along a path (7). A writing nozzle discharges an adhesive i.e. epoxy adhesive, from a start point (11) of the line (8) to an end point (12) of the line (10) along the path. #CMT#USE : #/CMT# Adhesive i.e. epoxy adhesive, pattern for bonding a semiconductor chip on a substrate. #CMT#ADVANTAGE : #/CMT# The pattern allows the writing nozzle to quickly discharge the adhesive along the path, thus reducing process time and tail breaking time, and improving process quality. #CMT#DESCRIPTION OF DRAWINGS : #/CMT# The drawing shows a top view illustrating writing movement of a nozzle for producing an adhesive pattern. 1 : Substrate 6 : Adhesive pattern 7 : Path 8-10 : Lines 11 : Start point 12 : End point.
申请公布号 CH699664(A2) 申请公布日期 2010.03.15
申请号 CH20100000148 申请日期 2010.02.05
申请人 ESEC AG 发明人 ROLAND STALDER
分类号 H01L21/58 主分类号 H01L21/58
代理机构 代理人
主权项
地址