METHOD FOR NICKEL-GOLD PLATING AND PRINTED CIRCUIT BOARD

摘要

PURPOSE: A nickel-gold plating method and a printed circuit board are provided to form a nickel-gold plating layer with high quality by suppressing an over immersion of a nickel plating layer in an electroless gold plating process without additional equipment. CONSTITUTION: A first nickel plating layer(20) is formed on the surface of an object(10). A second nickel plating layer(30) is formed on the first nickel plating layer. A gold plating layer(40) is formed on the second nickel plating layer. In a process of forming the first nickel plating layer, a catalyst is attached to the object. The object is electroless-nickel plated. The catalyst includes palladium. In the process of forming the second nickel plating layer, the catalyst is attached to the first nickel plating layer. The first nickel plating layer is electroless-nickel plated.