LED PACKAGE

摘要

PURPOSE: A light emitting diode(LED) package is provided to maximize the heat radiation effect of the package by protruding a plurality of heat-sink plates on the peripheral side of a heat-sink. CONSTITUTION: An LED package includes a heat-sink(110), a package body(120) with a cavity, a pair of lead frames(130) and an LED chip(140). A plurality of heat-sink plates(113) is protruded on the peripheral side of the heat-sink in a radial shape. A space for filling a molding material is formed between the heat-sink plates. The package body is placed on the upper side of the heat-sink. The lead frames are arranged on the upper side of the heat sink and are expanded to both sides of the heat sink. The LED chip is mounted in the cavity.