ADHESIVE FILM, CONNECTING METHOD AND CONNECTED BODY

摘要

Provided are an adhesive film which can connect an electronic component to a substrate without causing short-circuiting, a connecting method and a connected body. The adhesive film is provided with a first adhesive layer wherein conductive particles are dispersed, and a second adhesive layer adhered on the first adhesive layer. The first and the second adhesive layers are adhesive films containing a sub resin composition. The first adhesive layer contains a first main resin composition having a glass transition temperature higher than that of the sub resin composition. The second adhesive layer contains a second main resin composition, which has a glass transition temperature higher than that of the sub resin composition but lower than that of the first main resin composition. The reaction peak temperature of the first and the second adhesive layers is lower than the glass transition temperature of the first main resin composition but higher than that of the second main resin composition.