发明名称 LED PACKAGE MODULE
摘要 <p>PURPOSE: A light emitting diode(LED) package module is provided to stably combine an LED package to a printed circuit board by assembling the screw thread of a socket assembly unit and the thread groove of a socket unit. CONSTITUTION: An LED package module(100) includes a printed circuit board(110), an LED package(120) and a socket unit(130). The printed circuit board includes a socket assembly unit including a screw thread. The socket unit is integrated into the lower side of the LED package. The socket unit includes a thread groove corresponding to the screw thread. The printed circuit board and the LED package are combined by assembling the screw thread and the thread groove.</p>
申请公布号 KR20100028136(A) 申请公布日期 2010.03.12
申请号 KR20080081680 申请日期 2008.08.21
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SHIN, CHANG HO;KWAK, NO JUN;JEONG, YOUNG SIK
分类号 H01L33/48;H01L33/50;H01L33/62;H05K1/02 主分类号 H01L33/48
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