| 摘要 |
<p>The process of soldering electronic components on a printed circuit (5) by reflow using laser holography, comprises irradiating the printed circuit, which is screen printed by a solder paste, with a light wave surface (4) having a form capable of focusing specific quantities of heat energy only where the welding is necessarily created by a hologram (3) or other diffraction grating when coherent light (2) produced by a laser (1) crosses the hologram or diffraction grating.</p> |
