| 摘要 |
A lead frame (1) comprises a stage (5) for mounting a semiconductor chip (3) thereon, a plurality of leads (6, 7) arranged in the periphery of the stage, and a plurality of lead interconnection members (e.g., dam bars) (9) for interconnecting the leads, wherein a plurality of through holes (17, 18) are formed to penetrate through the lead frame in a thickness direction with respect to the leads or the lead interconnection members so as to allow a plurality of cutting lines (A, B) to pass therethrough, whereby the leads are subjected to cutting and are made electrically independent of each other. A semiconductor package of a QFN type is produced by enclosing the lead frame within a molded resin (13), from which the leads are partially exposed to the exterior and are subjected to plating and are then subjected to cutting at the cutting lines. |
