发明名称 PHOTOSENSITIVE POLYMER FOR PHOTORESIST AND MANUFACTURING METHOD THEREOF AND PHOTORESIST COMPOSITION COMPRISING THEREOF
摘要 <p>PURPOSE: A photosensitive polymer for a photoresist, a manufacturing method thereof, and a photoresist composition comprising the same are provided to be used in a lithographic process using a DUV excimer-laser source due to excellent etching resistance and adhesion with an underlayer. CONSTITUTION: A photosensitive polymer for a photoresist comprises a structure of chemical formula 1. In chemical formula 1, R1 and R2 are C1 ~ 10 alkyl group; R3 is a methyl group, ethyl group or isopropyl group; x, y and z are 1 ~ 60 mole % as mole % of each repeating unit. The photosensitive composition comprises the photosensitive polymer, photoacid generator, and organic solvent.</p>
申请公布号 KR20100028246(A) 申请公布日期 2010.03.12
申请号 KR20080087180 申请日期 2008.09.04
申请人 DONGBU HITEK CO., LTD. 发明人 PARK, CHAN SIK
分类号 G03F7/039;G03F7/004 主分类号 G03F7/039
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