| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a practical inductive chip link. <P>SOLUTION: A multilayer semiconductor device includes: a first inductive chip L1 having a first function; and second and third inductive chips M1, M2 stacked on the first inductive chip L1 and having second functions different from the first function. The first, second and third inductive chips L1, M1 and M2 have a plurality of transmission/reception inductors TX, RX laid out in the same way. The transmission/reception inductors TX, RX are disposed in a linear symmetry for a symmetrical axis. Symmetrical axes of the first, second and third inductive chips L1, M1 and M2 match one another. The second and third inductive chips M1 and M2 are disposed so as to be reverse in front and rear directions, or reverse in up-and-down directions with respect to the chip L1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
