| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermal processing apparatus which has high cooling effect and can shorten cycle time of product manufacture. <P>SOLUTION: A coil heater 14 is energized and an atmosphere temperature is raised to near 800°C so as to form a coat on a surface of a semiconductor wafer W. When a heating processing is terminated, a cooling medium such as water is immediately supplied to cylindrical space S as cooling space or through-holes 18 and the atmosphere temperature is dropped to near 400°C. The semiconductor wafer W after the processing is discharged in an inverse procedure, and a new unprocessed wafer is put in a reaction chamber 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
