| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing an optical semiconductor which can give a cured product to exert an excellent crack resistance while maintaining a high heat resistance and the transparency. SOLUTION: This resin composition for sealing an optical semiconductor contains: a rubber particle-dispersed curable epoxy resin (A) in which an alicyclic epoxy resin is made to disperse such rubber particles that comprise a polymer having a (meth)acrylic acid ester as an essential monomer component and have on the surface a hydroxyl group and/or a carboxyl group as a functional group reactive with an epoxy group and have an average particle diameter of 10-500 nm, a maximal particle diameter of 50-1,000 nm and have a difference in the refractive index from a cured product of this resin composition for sealing an optical semiconductor of within±0.02; a multifunctional thiol (B); a curing agent (C); and a curing accelerator (D). COPYRIGHT: (C)2010,JPO&INPIT |
