| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for removing a foreign material that can remove a foreign material that adheres to a fine concave part, and a method for manufacturing a semiconductor device. <P>SOLUTION: A tip of a carbon nanotube 13 is lowered toward a concave part 11 where a foreign material 5 is present until the tip of the carbon nanotube 13 touches the bottom face 11a of the concave part (groove) 11. The carbon nanotube 13 is further lowered such that the carbon nanotube 13 is bowed and the lateral face 13a of the carbon nanotube 13 is pressed against the bottom face 11a of the concave part 11. While the lateral face 13a is pressed against the bottom face 11a of the concave part 11, the carbon nanotube 13 is moved on the bottom face 11a of the concave part 11, thereby applying force to the foreign material 5. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
