IGNITION OF REACTIVE MULTILAYER FOILS IN MICROELECTRONICS ASSEMBLIES

摘要

An ignition trace pattern (10) on a printed circuit board (19) for conveying an initiating electrical current to a reactive multilayer foil preform (14) in a bonding region. The ignition trace (10) includes an ignition pad (11) disposed on the printed circuit board (19) adjacent to, but electrically isolated from, a bond pad (12) in the bonding region on the printed circuit board (19), a remote pad (13) disposed outside the bonding region on the printed circuit board (19) to which an electrode (16) may be electrically connected for delivering an initiating electrical current, and a trace (18) connecting the remote pad (13) and the ignition pad (11). The trace (18) is configured to conduct an initiating electrical current from the remote pad (13) to the ignition pad (11) and into any adjacent reactive multilayer foil performs (14) in electrical contact with the ignition pad (11) in the bonding region.