发明名称 |
Montageapparat für Elektronikteile und Montageverfahren derselben |
摘要 |
An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width. |
申请公布号 |
DE10211553(B4) |
申请公布日期 |
2010.03.11 |
申请号 |
DE2002111553 |
申请日期 |
2002.03.15 |
申请人 |
PANASONIC CORP. |
发明人 |
NAGAO, KAZUHIDE;TSUTSUMI, TAKUYA;NODA, TAKAHIRO;SUMI, HIDEKI |
分类号 |
H05K13/00;H05K13/04 |
主分类号 |
H05K13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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