| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit module having a high insulation properties against noises generated from an electronic component, and allowing miniaturization. <P>SOLUTION: A circuit module 100 includes a sealing layer 14 for sealing an electronic component 11 and a fixed potential electrode 12 on one main surface of a substrate 10, the first conductive resin layer 15 arranged on the sealing layer 14, the second conductive resin layer 16 arranged on the side surface of the sealing layer 14, and a through hole electrode 17, which penetrates the sealing layer 14 to electrically connect the fixed potential electrode 12 to the first conductive resin layer 15. <P>COPYRIGHT: (C)2010,JPO&INPIT |
