发明名称 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD OF MANUFACTURING RUGGED SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition involving little bubbles even when applied to a substrate with level difference, and a fall in film thickness due to trailing at a stepped part while holding general characteristics required of a photosensitive resist. <P>SOLUTION: The photosensitive resin composition contains (A) resin containing a carboxyl group and/or a vinyl group, (B) a photopolymerization initiator having an oxime ester skeleton, (C) a photosensitizer having maximum absorption wavelength in 370-420 nm, and (D) a photo-crosslinking monomer. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010054847(A) 申请公布日期 2010.03.11
申请号 JP20080220229 申请日期 2008.08.28
申请人 HITACHI CHEM CO LTD 发明人 KATAKI HIDEYUKI;YOSHINO TOSHISUMI;OKAWA MASAYA;KAMIYA YUKIO
分类号 G03F7/031;C08F290/06;G03F7/004;G03F7/027;G03F7/40;G11B21/21;H01L21/027 主分类号 G03F7/031
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