| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device or the like whose connecting reliability with a circuit board is improved, while allowing the formation of multiple terminals without using any special material. <P>SOLUTION: The semiconductor device 3 is equipped with: semiconductor elements 31; an element fixing board 32 having a front surface F and a rear face B, in which the semiconductor elements 31 are fixed on the front surface F; and a plurality of coupling members 33 arranged on the rear face B of the element fixing board 32 in a two-dimensional shape for coupling a circuit board 2 and the element fixing board 32. The semiconductor device is also characterized in that the coupling members 33 are arranged inside and outside a coupling prohibited area 321 on the rear face B while avoiding the coupling prohibited area 321 which overlaps a contour of the semiconductor elements 31 in a plane view and makes a round and is wider than a width in which the coupling members 33 can be arranged. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
