| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for mounting a semiconductor device that can prevent a crack of the semiconductor device 1, and the chipping of the semiconductor device 1 when the semiconductor 1 is mounted to a mounting member 2. <P>SOLUTION: When the semiconductor device 1 is mounted to the mounting member 2, an adhesive material 3 is disposed on the mounting member 2, and then the semiconductor device 1 arranged on a supporting material 8 located over the mounting member 2 where the adhesive material 3 is disposed. Then, a portion with the adhesive material 3 in the mounting member 2 is pushed up by a jig 9 from the lower part of the mounting member 2 so that the adhesive material 3 may contact with the semiconductor device 1. After that, the semiconductor device 1 is separated from the supporting material 8 by lowering the jig 9, and mounted to the mounting member 2. Using such a mounting method for the semiconductor device 1, the semiconductor device 1 adhered to the supporting material 8 can be directly mounted to the mounting member 2, so that the crack of the semiconductor device 1 and the chipping of part of the semiconductor device 1 can be prevented. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
