METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH THIN METAL CONTACTS
摘要
Methods and arrangements are described for forming an array of contacts for use in packaging one or more integrated circuit devices. In particular, various methods are described for forming contacts having thicknesses less than approximately 10 µm, and in particular embodiments, between 0.5 to 2 µm.
申请公布号
WO2010008673(A3)
申请公布日期
2010.03.11
申请号
WO2009US44396
申请日期
2009.05.18
申请人
NATIONAL SEMICONDUCTOR CORPORATION;NGUYEN, LUU, T.;PODDAR, ANINDYA;LEE, SHAW, W.;PRABHU, ASHOK, S.
发明人
NGUYEN, LUU, T.;PODDAR, ANINDYA;LEE, SHAW, W.;PRABHU, ASHOK, S.
