SEMICONDUCTOR FABRICATION DEVICE COMPONENT AND SEMICONDUCTOR FABRICATION DEVICE

摘要

Disclosed are a semiconductor fabrication device component and a compound semiconductor fabrication device component, provided with a component body and a sprayed coating formed on the surface of the aforementioned component body by spraying nitride particles. The semiconductor fabrication device component and the compound semiconductor fabrication device component are characterized by the nitride particles being deposited in an unmelted state to constitute 90% by mass of the aforementioned sprayed coating. In a sprayed coating formed by rapid solidification of melted fused particles, many microcracks occur in the particles, and remain in a distorted state, so particles are produced as dust from the sprayed coating on the component in a plasma discharge process. Thus, the present invention provides a semiconductor fabrication device component and a compound semiconductor fabrication device component that reliably and effectively suppress the production of the aforementioned dust.