| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has superior reliability and element characteristics by independently optimizing characteristics that a provided insulating layer needs to have and bonding characteristics of a predetermined semiconductor thin film, and to provide an optical print head using the same. <P>SOLUTION: The semiconductor device has a substrate 1, and an organic thin film 3 having a high polarization property is formed on a DLC film 2 provided on the substrate 1 to bond the semiconductor thin film 10. Consequently, strong interaction with a semiconductor thin film surface is obtained to bond it with high bonding strength. Further, thickness of the organic thin film 3 is made smaller than that of the ground DLC film 2. Consequently, conductivity of heat from the semiconductor thin film 10 to the DLC film 2 is improved and when a material with high heat conductivity is used for the substrate 1 on which the DLC film 2 is formed, the heat is efficiently dissipated through the substrate 1. <P>COPYRIGHT: (C)2010,JPO&INPIT |
