发明名称 HEAT CONTROL DEVICE AND METHOD OF MANUFACTURING THE SAME
摘要 Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.
申请公布号 US2010059212(A1) 申请公布日期 2010.03.11
申请号 US20070517344 申请日期 2007.10.31
申请人 ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE 发明人 MOON SEOK-HWAN;HWANG GUNN
分类号 F28F13/00;B21D53/02 主分类号 F28F13/00
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