发明名称 |
HEAT CONTROL DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Provided are a heat control device and a method of manufacturing a heat control device. The method of manufacturing a heat control device having an envelope used as a path of a working fluid that absorbs/dissipates heat by a latent heat transfer and a groove formed in an inner wall of the envelope and generating a capillary force moving the working fluid, wherein the method includes: providing first and second templates each including a protruding portion having a shape corresponding to the groove; forming first and second deposition films by depositing metal on the first and second templates; stacking first and second metal plates respectively on the first and second deposition films; burning out the first and second templates from the first and second metal plates; and forming the envelope by combining the first and second metal plates.
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申请公布号 |
US2010059212(A1) |
申请公布日期 |
2010.03.11 |
申请号 |
US20070517344 |
申请日期 |
2007.10.31 |
申请人 |
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE |
发明人 |
MOON SEOK-HWAN;HWANG GUNN |
分类号 |
F28F13/00;B21D53/02 |
主分类号 |
F28F13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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