发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME |
摘要 |
A photosensitive resin composition includes an alkali-soluble resin having a polybenzoxazol precursor structure or a polyimide precursor structure, or both, and a photosensitizer, the alkali-soluble resin having a ratio ([A]/[B]) of a cyclization rate [A] (%) at 250° C. to a cyclization rate [B] (%) at 300° C. of 0.70 or more. According to the present invention, a photosensitive resin composition which is highly sensitive and has high productivity in the manufacture of semiconductor devices, a cured film, a protective film, an insulating film, and a semiconductor device and a display device using the cured film can be provided.
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申请公布号 |
US2010062273(A1) |
申请公布日期 |
2010.03.11 |
申请号 |
US20080525309 |
申请日期 |
2008.02.18 |
申请人 |
SUMITOMO BAKELITE CO., LTD |
发明人 |
MAKABE HIROAKI;TERAKAWA KOJI |
分类号 |
B32B27/06;B32B9/04;C08J3/28 |
主分类号 |
B32B27/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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