GRINDER OF WAFER, AND MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a grinder or the like capable of grinding a substrate of a wafer in a uniform thickness.

SOLUTION: The grinder II of a wafer 10 is provided with a substrate 10a and a compound semiconductor layer formed on the substrate 10a. The grinder ll of the wafer 10 includes: a grinding surface plate 34 having a grinding plane 34 for grinding the substrate 10a of the wafer 10; a carrier plate (fixing plate) 31 arranged so as to face the grinding plane 34a of the grinding surface plate 34 and fixing the wafer 10 so that the substrate 10a of the wafer 10 faces the grinding plane 34a; and a pressing member 20 changing a shape of the carrier plate 31 so as to copy a shape of the grinding plane 34a of the grinding surface plate 34 and applying pressure to make the substrate 10a of the wafer 10 contact with the grinding plane 34a through the carrier plate 31.

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