发明名称 |
METHOD FOR MANUFACTURING SOI SUBSTRATE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent oxygen from being taken in a single-crystal semiconductor layer in laser beam irradiation even when crystallinity of the single-crystal semiconductor layer is recovered by irradiation with a laser beam; and to make substantially equal or reduce the concentration of oxygen included in the single-crystal semiconductor layer after the laser beam irradiation relative to that before the laser beam irradiation. <P>SOLUTION: A method of manufacturing an SOI substrate includes a process of recovering the crystallinity of the single-crystal semiconductor layer (recrystallization) by irradiating a single-crystal semiconductor layer formed on a base substrate by being stuck thereon with a laser beam. The laser irradiation is performed under a reducing atmosphere or an inert atmosphere. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010056543(A) |
申请公布日期 |
2010.03.11 |
申请号 |
JP20090177815 |
申请日期 |
2009.07.30 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
SHIMOMURA AKIHISA;ONUMA HIDETO;MOMO JUNPEI;YAMAZAKI SHUNPEI |
分类号 |
H01L21/02;H01L21/20;H01L21/265;H01L21/268;H01L21/322;H01L21/336;H01L21/8238;H01L27/08;H01L27/092;H01L27/12;H01L29/786 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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