| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a transfer mold type electronic control device of a compact size and high reliability capable of being built in a mechanical component. <P>SOLUTION: In the electronic control device, a substrate mounted with an electronic component of a surface mounting type is transfer-molded. The transfer mold type electronic control device has two or more substrates, at least one of the substrates is double-side mounted, and the substrates are arranged by laminating with gaps, and the device has a supporting structure wherein an interval between the substrates is fixed constant. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
