发明名称 SUBSTRATE TREATMENT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a heat treatment device capable of preventing the contamination of the inside of a furnace since dirt on the floor is adhered to a sealing surface and is brought into the furnace when placing a quartz component on the floor. SOLUTION: The heat treatment device includes: a reaction tube comprising an outer tube 14 and an inner tube formed of quartz; a first junction surface for airtightly joining an area between the outer tube and a manifold 50 formed of quartz; a second junction surface for airtightly joining an area between the manifold and a seal cover 31 formed of quartz; and a third junction surface for airtightly joining an area between the seal cover and a seal cap 30. The heat treatment device includes an O ring 53 on at least one junction surface of the first, second, and third junction surfaces, and a projection outside the O ring section of the junction surface. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010056300(A) 申请公布日期 2010.03.11
申请号 JP20080219724 申请日期 2008.08.28
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MORITA SHINYA;NAKADA TAKAYUKI;MATSUDA SATOYUKI;SAKASHITA KEISUKE
分类号 H01L21/31;C23C16/44;H01L21/205;H01L21/22;H01L21/324 主分类号 H01L21/31
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