发明名称 |
SUBSTRATE TREATMENT DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment device capable of preventing the contamination of the inside of a furnace since dirt on the floor is adhered to a sealing surface and is brought into the furnace when placing a quartz component on the floor. SOLUTION: The heat treatment device includes: a reaction tube comprising an outer tube 14 and an inner tube formed of quartz; a first junction surface for airtightly joining an area between the outer tube and a manifold 50 formed of quartz; a second junction surface for airtightly joining an area between the manifold and a seal cover 31 formed of quartz; and a third junction surface for airtightly joining an area between the seal cover and a seal cap 30. The heat treatment device includes an O ring 53 on at least one junction surface of the first, second, and third junction surfaces, and a projection outside the O ring section of the junction surface. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010056300(A) |
申请公布日期 |
2010.03.11 |
申请号 |
JP20080219724 |
申请日期 |
2008.08.28 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
MORITA SHINYA;NAKADA TAKAYUKI;MATSUDA SATOYUKI;SAKASHITA KEISUKE |
分类号 |
H01L21/31;C23C16/44;H01L21/205;H01L21/22;H01L21/324 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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