发明名称 Mulit-layer embedded capacitance and resistance substrate core
摘要 A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
申请公布号 US2010060381(A1) 申请公布日期 2010.03.11
申请号 US20080283146 申请日期 2008.09.09
申请人 ENDICOTT INTERCONNECT TECHNOLOGIES, INC. 发明人 DAS RABINDRA N.;LAUFFER JOHN M.;MEMIS IRVING;ROSSER STEVEN G.
分类号 H03H7/00;H05K3/30 主分类号 H03H7/00
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