发明名称 |
Mulit-layer embedded capacitance and resistance substrate core |
摘要 |
A multi-layer imbedded capacitance and resistance substrate core. At least one layer of resistance material is provided. The layer of resistance material has a layer of electrically conductive material embedded therein. At least one layer of capacitance material of high dielectric constant is disposed on the layer of resistance material. Thru-holes are formed by laser.
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申请公布号 |
US2010060381(A1) |
申请公布日期 |
2010.03.11 |
申请号 |
US20080283146 |
申请日期 |
2008.09.09 |
申请人 |
ENDICOTT INTERCONNECT TECHNOLOGIES, INC. |
发明人 |
DAS RABINDRA N.;LAUFFER JOHN M.;MEMIS IRVING;ROSSER STEVEN G. |
分类号 |
H03H7/00;H05K3/30 |
主分类号 |
H03H7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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