MOUNTING EVALUATION STRUCTURE AND MOUNTING EVALUATION METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounting evaluation structure and a mounting evaluation method, which three-dimensionally evaluate a mounting state of a chip on a substrate without depending on viewing. SOLUTION: A plurality of capacitance parts 30 including a plurality of first electrode patterns 30a arranged on a mounting face 10a of a mounting evaluation substrate 10 and a plurality of second electrode patterns 30b which confront with the first electrode patterns 30a and are installed on a lower face 20a of a mounting evaluation chip 20 are formed in the mounting evaluation structure. Capacitances in a plurality of the capacitance parts 30 are compared. The mounting state of the mounting evaluation chip 20 on the mounting evaluation substrate 10 is evaluated based on a comparison result. COPYRIGHT: (C)2010,JPO&INPIT