发明名称 |
EPITAXIAL SUBSTRATE FOR FORMATION OF SEMICONDUCTOR ELEMENT FOR HIGH FREQUENCY, AND MANUFACTURING METHOD OF EPITAXIAL SUBSTRATE FOR FORMATION OF SEMICONDUCTOR ELEMENT FOR HIGH FREQUENCY |
摘要 |
PROBLEM TO BE SOLVED: To provide an epitaxial substrate capable of implementing a semiconductor element for high frequency operation which has a cost merit and is superior in characteristics. SOLUTION: With respect to the epitaxial substrate, a foundation layer made of a first group III nitride having an insulating property is epitaxially formed on a base material made of conductive SiC or Si by an MOCVD method so that a substantially aperiodic concave-convex structure is provided on a surface. A channel layer made of GaN is epitaxially formed on the foundation layer, and a barrier layer made of Al<SB>x</SB>Ga<SB>1-x</SB>N (0<x<1) is epitaxially formed on the channel layer. COPYRIGHT: (C)2010,JPO&INPIT
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申请公布号 |
JP2010056298(A) |
申请公布日期 |
2010.03.11 |
申请号 |
JP20080219708 |
申请日期 |
2008.08.28 |
申请人 |
NGK INSULATORS LTD |
发明人 |
MIYOSHI MAKOTO;KURAOKA YOSHITAKA;SUMIYA SHIGEAKI;ICHIMURA MIKIYA;TANAKA MITSUHIRO |
分类号 |
H01L21/205;C23C16/34;H01L21/338;H01L29/778;H01L29/812 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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