| 摘要 |
PROBLEM TO BE SOLVED: To provide a material which has a high thermal conductivity equivalent to conventional cladding materials with a less thermal expansion coefficient. SOLUTION: The layer 11 is an outside Cu layer (outside layer:Cu layer), the layer 12 is an inside Cu layer (inside layer: Cu layer), and the layer 15 is an Mo layer. The Cu layers 11 and 12 are laminated with the Mo layer 15 in between, and the total number of layers is seven. Here, the outermost layer (top layer and bottom layer in Fig.1) is the outside Cu layer 11, and the Cu layer other than this layer is the inside Cu layer (inside layer) 12. So, the Mo layer 15 exists on one side of the outside Cu layer 11 and on both sides of the inside Cu layer 12. The thickness of the outside Cu layer 11 (one side) which is affected only by the Mo layer on one surface side is 25% or less for the sum (total film thickness of first material) of thicknesses of all Cu layers. The thickness (thickness of inside layer) of the thickest layer among the inside Cu layers 12 is 50% or less of the sum (total film thickness of first material layer) for the thicknesses of all the Cu layers. COPYRIGHT: (C)2010,JPO&INPIT
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