发明名称 |
METHOD OF PROCESSING A SUBSTRATE |
摘要 |
A method of processing a substrate using plasma includes loading a substrate into a chamber, processing the substrate with a first plasma mode and then processing the substrate with a second plasma mode, wherein at least one of the first plasma mode and the second plasma mode is a time-modulation mode in which a plasma induced in the chamber is periodically turned on and off to reduce plasma-induced damage in the substrate.
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申请公布号 |
US2010062613(A1) |
申请公布日期 |
2010.03.11 |
申请号 |
US20090469776 |
申请日期 |
2009.05.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM YOON-JAE;KIM YONG-JIN;TOKASHIKI KEN;BAI KEUN-HEE |
分类号 |
H01L21/469;C23C16/505;C23C16/52 |
主分类号 |
H01L21/469 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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