| 摘要 |
<p>PURPOSE: An activating solution for electroless plating is provided to directly form an electroless palladium or gold plating film on a copper film of a printed wiring board or a silver paste film of an electronic component. CONSTITUTION: An activating solution for electroless plating comprises soluble palladium compounds, at least one kind of halide, and at least one kind of nitrogen atom containing compound. The halide is selected from the group consisting of halogenated hydrogen acid, metal halide, and ammonium halide. The nitrogen atom containing compound is selected from the group consisting of alkylene diamine, polyalkylene polyamine, polyalkylene polyamine, and crosslinkage of polyamide polyamine.</p> |
