| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the connection between a probe assembly which is assembled with a narrow pitch and a printed wiring board in a crude pitch. SOLUTION: In the prober apparatus making an electrical connection with a test apparatus via probes by contacting a semiconductor chip to be tested with the probes, a probe assembly having output terminals directly connected to probes being unified by arranging a plurality of probes containing the output terminals and a plurality of layers of the printed wiring board, in which the wiring is contactingly formed on the surface of a non-conductive film, are formed. The land arrays formed on the one end of the n-th layer of the printed wiring board and the output terminals of the n-th row of the probe assembly are contacted, and the wiring terminals formed on the other end of the printed wiring board are connected to a test apparatus wiring board or a connector. Thereby the semiconductor chip to be tested is electrically connected with the test apparatus. COPYRIGHT: (C)2010,JPO&INPIT
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