| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase heat radiating efficiency while reducing thermal contact resistance by a simple constitution to ensure size reduction. Ž<P>SOLUTION: A heat conduction plate 202 which abuts on another wall face of a receiving groove 11 to be thermally coupled to an attaching member 20 which fixedly disposes a circuit unit 13 in the receiving groove 11 by bringing a frame member 17 which is thermally coupled to a heat conduction member 18 which is thermally coupled to the circuit unit 13 into pressure contact with one wall face of the receiving groove 11 in an equipment housing 10 is provided. The leading end of the heat conduction plate 202 is thermally coupled to the circuit unit 13 to thermally couple the circuit unit 13 to the equipment housing 10 by two systems of both the wall faces of the receiving groove 11 sandwiching the attaching member 20. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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