发明名称 GRINDING WHEEL
摘要 PROBLEM TO BE SOLVED: To provide a grinding wheel which can decrease the number of times to dress its grinding wheel body and which does not crack a wafer. SOLUTION: The grinding wheel is detachably attached to a wheel mount of a grinding device which has a grinding fluid supply means to supply grinding fluid, a rotatively driven spindle, and the wheel mount connected at a distal end of the spindle; wherein the grinding wheel is provided with an annular base having an inner circumferential wall, an outer circumferential wall, and an attachment portion for attaching the grinding wheel to the wheel mount and with a plurality of grinding wheel bodies disposed in an annular manner at a free end portion of the annular base, the outer circumferential wall of annular base having a plurality of through holes formed in a circumferential direction at prescribed intervals in such a manner as to extend through to the inner circumferential wall to discharge grinding dust together with the grinding fluid. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010052076(A) 申请公布日期 2010.03.11
申请号 JP20080218239 申请日期 2008.08.27
申请人 DISCO ABRASIVE SYST LTD 发明人 YAMAMOTO SETSUO
分类号 B24D7/00;B24B55/02;B24D7/06;B24D7/10 主分类号 B24D7/00
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