SPUTTERING APPARATUS AND MULTI-CHAMBER COMPRISING THE SAME

摘要

The present invention relates to a sputtering apparatus and a multi-chamber comprising the same, which can reduce manufacturing costs and increase deposition efficiency. The present invention discloses a sputtering device including: a chamber; a target unit arranged in the chamber, and which contains a target; a substrate support unit arranged opposite the target unit, and which fixes and supports a substrate; and a shadow mask interposed between the target unit and the substrate support unit, and which contains a plate and a hole formed in the plate, wherein the target and the hole are positioned in correspondence with one another.