| 摘要 |
<p>PURPOSE: A semiconductor wafer is provided to protect a circuit and an electric connection pad on the surface of the wafer from an external moisture and contamination source using the adhesive protection layer. CONSTITUTION: A wafer main body includes a first surface(11) and a second surface(13). A plurality of electric connection pads(17) is formed on the second substrate. An adhesive protection layer(19) is formed on the second surface and the electric connection pads. The adhesive protection layer includes a photosensitive adhesive, a thermosetting adhesive and a dielectric material. A semiconductor wafer is mounted on a package carrier by the adhesive protection layer. The semiconductor wafer is singulated.</p> |
