发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
PURPOSE: A method for manufacturing a semiconductor device and an apparatus for processing a substrate are provided to form a nitride silicon layer including excessive silicon by optimizing the composition ratio of silicon and nitrogen. CONSTITUTION: Dichlorosilane is applied to a substrate to form a silicon layer under a CVD reaction condition. Ammonia is applied to the substrate under a non-plasma atmosphere. Nitration is performed by the silicon layer and the ammonia. There is an insufficient amount of ammonia when thermal-nitration is performed on the silicon layer. A nitride silicon layer including excessive silicon is formed.
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申请公布号 |
KR20100027989(A) |
申请公布日期 |
2010.03.11 |
申请号 |
KR20090082135 |
申请日期 |
2009.09.01 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
HIROSE YOSHIRO;TAKASAWA YUSHIN;KATO TOMOHIDE;AKAE NAONORI |
分类号 |
H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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地址 |
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