| 摘要 |
PURPOSE: A lead-frame and a method for manufacturing the same and an LED device including the same are provided to stably mount the lead-frame on a printed circuit board(PCB) by improving the structure of the lead-frame. CONSTITUTION: A lead-frame(1) includes a lead-pin(110), a radiation part(120) and an insulation casing(200). The insulating casing includes a bare chip loading part(210), and a bonding groove and a PCB mounting part(220). The bare chip loading part houses the upper surface of the lead-pin and the radiation part. The lower surface of the radiation part and the lead-pin are combined to the metal wiring area of the PCB through the bonding groove. The PCB mounting part houses the lower surface of the lead-pin and the radiation part.
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